The table below shows delamination determination after MSL 1 pre-conditioning tests.
Monitoring results have shown no delamination detected over the past 5 years.


Temperature has a direct impact on the operating performance and reliability of semiconductor devices. Devices that operate
at high junction temperatures for a long period of time can sustain permanent damage and shorten lifetimes.
At Mini-Circuits, MMIC amplifier junction temperature measurement and monitoring is performed on every production wafer
lot to ensure our customers receive products with the highest quality, reliability and performance.


Benefits:
Reliability Monitoring is used to evaluate product reliability performance throughout a product’s lifetime. Comprehensive qualifications are performed for process and materials changes during the product’s lifetime. A Reliability Database tracks
the reliability performance over time and archives all qualification data. This database provides a complete record of each product’s reliability history. |