Mini-Circuits Mini-Circuits
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ArrowBulletQuality Management Principles
ArrowBulletAnti-Counterfeit Policy
ArrowBullet Code of Conduct /  
Conflict Metals
ArrowBulletEnvironmental Compliance
ArrowBullet ISO9001, AS9100, ISO14001
Certifications
ArrowBulletRoHS / Reach
ArrowBullet Semiconductor Quality Overview
ArrowBulletWarranty - Mechanical Switches
  Quality Manufacturing
 
 

 


 
 
Electronic Wafer Mapping

Every die on our wafers is individually tested and electronically mapped according to key performance parameters, enabling us to select specific die for specific production requirements. This results in products with very consistent and tightly distributed performance.

 

 

In-Process Controls

Wafer Mapping
Wafer maps provide the location of specific die with specific performance features, allowing us select the die we need to meet packaged device requirements.This enables us to deliver production lots with customer-specific or tight performance distributions.

Process Monitors
Our process monitors give us continuous feedback on the performance of our assembly systems, to make sure they are operating as designed to produce high quality products. Critical machine performance parameters are monitored using control charts, which are reviewed frequently to keep our processes in control.

In-Process Inspections
In-process inspections give us real-time process feedback to fine tune processes or make immediate corrections, to insure that products meet our quality standards, before they are allowed to be processed further.

Material Selection
We use mold compounds, lead frame materials, and package designs with excellent heat dissipation properties, that improve product performance and long-term reliability, and that also meet regulatory requirements.
All Mini-Circuits semiconductor products are offered in RoHS compliant models.

Performance Monitors
Environmental testing such as temp cycling, helps us monitor our products’ reliability. HTOL, HAST, and other operating life tests give us the information needed to improve our production processes and future product designs. Performance monitors such as junction temperature measurements assure us that the product continues to meet data sheet requirements as originally designed. Tin whisker growth, solderablility, and other tests, help us monitor the integrity of our products.

 

In-Process Controls Details

Benefits:
Our extensive in-process controls provide early detection of process variation and potential quality issues, providing crucial information for real-time process corrections.

 

Dynamic Test Specifications

In pursuit of our goal to exceed our customers’ expectations, we test our products to statistically generated 4.5 sigma limits instead of the specification limits. As a result, the products that are shipped to our customers are very consistent in performance with tight distributions.

Diagram illustrates 4.5 sigma limits used instead of specification limits.
Only products from the shaded area for lot 1 will be tested good and shipped to customers.

 

Diagram illustrates 4.5 sigma limits used instead of specification limits.
Only products from the shaded area for lot 3 will be tested good and shipped to customers.

 

 

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