Transient Current Protection Circuit

The EXTRA-RELIABLE Amplifiers (ERA) Series amplifiers are based on InGaP HBT (Heterojunction-bipolar-transistor) technology and achieve wideband high gain performance via a Darlington configuration. HBT technology provides many benefits that are not available in commonly used MESFET devices, namely single supply voltage operation and unconditional stability through the entire amplifier frequency range.

However, current transients that occur during power-up can cause damage in any high gain amplifier that uses a Darlington configuration. To address this issue, we design amplifiers with transient current protection circuits, which prevent damaging of the circuits by unforeseen electrical spikes, while still providing state-of-the-art performance.

Die Layout

Features:
(a) Heat sources are separated to minimize heat coupling.
(b) Metal structures provide better heat sinks
(c) Double bonds on ground provides better grounding and heat dissipation.

Material Selection

Materials used for assembly have been carefully chosen to meet moisture sensitivity standards and improve thermal conductivity performance. Mini-Circuits’ stringent material selection improves GaAs thermal conductivity to prevent performance degradation and catastrophic failures.

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